| apu3d2 |
System board |
|---|
| Status
|
active |
| Part numbers
|
apu3d2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM
apu3d4 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM
apu3c2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu3c4 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded)
apu3b2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu3b4 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded)
apu3a2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu3a4 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded) |
| Application
|
This board version is targeted
at applications that require 2 3G / LTE modems. SIM sockets can be swapped
under GPIO control, enabling failover between two different networks even
when only one modem is used. Another feature is the build
option for a regular PCI express slot on the side. |
| Use with
|
case1d2u /
case1d2blku /
case1d2redu /
case1d2bluu enclosures
ac12veur3 /
ac12vus2 /
ac12vuk AC adapter
msata16g (and other sizes) mSATA SSD
sd4b SD card
wle200nx /
wle600vx / wle900vx
miniPCI express wireless modules
spi1a flash recovery module |
| Specification
|
- CPU: AMD Embedded G series GX-412TC, 1 GHz quad Jaguar core
with 64 bit and AES-NI support, 32K data + 32K instruction cache per core,
shared 2MB L2 cache.
- DRAM: 2 or 4 GB DDR3-1333 DRAM
- Storage: Boot from SD card (internal sdhci controller), external
USB or m-SATA SSD. 1 SATA + power connector. mSATA is shared with
miniPCI express.
- 12V DC, about 6 to 12W depending on CPU load. Jack = 2.5 mm, center
positive
- Connectivity: 3 Gigabit Ethernet channels (Intel i211AT)
- I/O: DB9 serial port, 2 USB 3.0 external + 4 USB 2.0 internal, three front panel
LEDs, pushbutton
- Expansion: 3 miniPCI express (J14 USB or mSATA, with SIM; J15 USB only,
with SIM; J16: full miniPCI express, but no SIM, intended for wifi).
GPIO header, optional I2C bus, COM2 (3.3V RXD / TXD).
- Board size: 6 x 6" (152.4 x 152.4 mm) - same as apu1d, alix2d13
and wrap1e.
- Firmware: coreboot
(please contact support@pcengines.ch for source code if desired).
- Cooling: Conductive cooling from the CPU to the
enclosure using a 3 mm alu heat spreader (included).
|
| OEM options
|
PCI express slot on the side, different number of LAN ports, etc. |
| Documentation
|
user's manual |
| Howto
|
HowTo collection |
| Cooling assembly
|
apu cooling assembly instructions |
| Version apu3d:
|
- Change battery socket footprint to avoid contact problems.
- Improve power regulator stability.
- Add optional 10 pin LPC header to support tpm4a module.
- Add W_DIS# series resistor to support Quectel EP06 modules.
- Some changes to avoid leakage between V3 and V3A power rails.
- Add signal integrity resistor for core voltage control signal.
|
| Version apu3c:
|
- Improve compatibility with LTE modem modules:
Disconnect SMB_DAT / SMB_CLK signals (1.8V level on Quectel).
- Improve compatibility with LTE modem modules:
No stuff diodes D4 / D17, option resistor bypass (extremely low VIL on Huawei modems,
sensitive to incoming EMI).
- Optional SIM presence indicator / SIM card detect.
- Disable non-functional NCT5104D watchdog timer.
- Increase 3.3V current limit to allow for two simultaneous LTE modems.
- Some DFM changes.
|
| Version apu3b:
|
Fixed USB header J13 pinout. |
| Version apu3a:
|
The pinout on USB header J13 is wrong, do not use. |
| BIOS update
|
Please see Howto collection for instructions on BIOS upgrade.
Update 3/2017: various fixes, enable additional USB ports,
iPXE with setup, set SIM switch GPIO to high. |
| Schematic
|
apu3a /
apu3b /
apu3c /
apu3d schematics, |
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. |
